Automatic thermographic glue control for high-productivity environments. Real-time monitoring of adhesive deposited by robots or automatic systems.
ThermoSpot® Glue is the thermographic system developed for real-time monitoring of adhesive deposited by robots or automatic systems. It guarantees speed, precision and complete traceability, reducing defects and waste in high-throughput industrial processes.
Every adhesive deposit is thermally analysed: glue applied at the correct temperature generates a characteristic thermal signature that the system recognises. In the event of an anomaly — missing glue, incorrect temperature, non-uniform distribution — an alarm is sent immediately to the machine PLC.
Designed for high-productivity environments, ThermoSpot® Glue integrates into automotive lines, industrial assemblies and technical packaging, ensuring continuous and reliable control of the bonding process.
| Sensor | Inline radiometric thermal camera |
| Analysis | Real-time on every part |
| Anomaly detection | Missing glue, wrong temp., non-uniform |
| Speed | Suitable for high-throughput lines |
| Output | OK / NOK in real time |
| PLC alarm | Digital I/O or protocol (OPC-UA, etc.) |
| Recipes | Automatic multi-model management |
| Archiving | Radiometric images + process data |
| Traceability | Complete for every part produced |
| Reports | Automatic for quality audits |
